Method of making semiconductor device



A ril 6, 1965 D. T. KELLEY METHOD OF MAKING SEMICONDUCTOR DEVICE Original Filed April 24. 1958 4 Sheets-Sheet 1 DALE T. KELLEY WWW ATTORNEY April 6, 1965 Original Filed April 24, 1958 o. 1'. KELLEY 3, 176,376 METHOD OF MAKING SEMICONDUCTOR DEVICE 4 Sheets-Sheet 2 .3- LOAD DICE I. LOAD BASE CONNECTOR 2. LOAD BASE SOLDER RING 4. CLOSE B FASTEN BOAT 101 l l f 1 4 05 III son INVERFIING snnou LOAD COLLECTOR WIRES IN BOAT (WIRE LOADER) ALLOY EMITTER SIDE (FUSION FURNACE) LOAD HEADER c-f-f-on rumucz TRACK ALLOY COLLECTOR WORK FEEDER LOAD COLLECTOR BEADS IN BOAT SIDE B BASE (BEAD LOADER) CONNECTION (FUSIONIFURNACE) BOAT LOAD EMITTER BEADS IN BOAT (HEAD LOADER) BOAT STATION LOAD EMITTER WIRES IN BOAT (WIRE LOADER) SOLDER WIRES (FUSION FURNACE) VIBRATOR MOUNTED 1 a 119 UNLOAD :23; Assails E[ I! SOLDER WIRES I 2 I MOUNTED (FUSION FURNACE) 1 122 VIBRATOR DROP sua-issv semen names on HEADER HIN l SOLDER SUB -ASSY T0 HEADER (FUSION FURNACE) -BACK FILLED PIN HOLE SEALED FINAL TEST --VACUUM amen -ercuzo 4 wusneo .cngcxgo -cAnNEO DALE Z'KELlEY ATTORNEY D. T. KELLEY METHOD OF MAKING SEMICONDUCTOR DEVICE April 6,1965

4 Sheets-Sheet 3 Original Filed April 24, 1958 SECOND 'POSITION INVENTOR DALE r KELLEY AYTORNEY' April 6, 1965 D. T. KELLEY METHOD OF MAKING SEMICONDUCTOR DEVICE 4 Sheets-Sheet 4 Original Filed April 24, 1958 INVENTOR. DALE 7. KELLEY A TTORNE'Y production costs.

Uit Sta ddibfiih Patented Apr. 6, 1965 3,176,376 METHQD OF MAKING SEMICQNBUCTUR DEVHQE Dale T. Kelley, Phoenix, Ariz assignor to Motorola,

' Inc, hicago, ill, a corporation of lllinois Continuation of application Ser. No. 736,642, Apr. 24, 1958. This application .lan. 17, 1963, Ser. No. 253,024

' 1 Claim. (Cl. 29-253) This application is a continuation of a copending application Serial No. 730,642, filed April 24, 1958, now abandoned.

This invention relates to manufacturing and structural improvements in the semiconductor ant, wherein the devices produced for use in electronic equipment are of diminutive size, and more particularly to alloy junction transistors of such size, as well as to an improved method for making such devices, and to apparatus for practicing such method. The invention provides a highly mechanized, efiicient and economical assembly operation and a device which lends itself to mass production, while permitting changes in the semiconductor subassembly within this device to permit a ready change to many different predetermined operating characteristics for the device which make it possible to adapt the same to many different application specifications. This flexibility is accomplished by the present invention with only minor changes in the process, manufacturing apparatus, and device structure itself.

In order to obtain certain electrical characteristics such as 'good high frequency response, it is desirable, in the present state of the art, to make a transistor quite small, or one might say, relatively minute. The manufacture .of such relatively minute devices poses many practical fabrication problems due to the size of the articles being assembled. Since a transistor normally includes several separate parts, the assembly process involves the alignment and connection of such parts in an accurate and uniform manner. Because the parts being assembled often have dimensions of only a few hundredths or even thousandths of an inch, their accurate positioning is extremely difficult. For example, certain alloy junction transistors include a wafer or die of a semiconductor material such as silicon or germanium which carries on its opposite faces minute electrodes of an impurity metal such as indium. The electrodes must be positioned accurately directly opposite one another on the germanium or silicon "die, and then heated so that they will fuse to thesurface of the semiconductor die and alloy into it a controlled distance in order to create two suitable rectifying junctions. Suitable lead wires must be electrically connected to each electrode in order to connect the device into a circuit. Since the diameter of the electrodes is often in the order of about 0.0l inch, it is difficult to align them directly opposite one another and it is equally diificult to position the lead wires accurately and secure them to the electrodes.

For instance, in a device wherein a semiconductor die carrying alloyed electrodes is connected to a mounting to form a subassembly which in turn is secured to the posts of a mounting header for the complete device, the

small size of the parts involved, makes proper alignment of the subassembly with the header posts difiicult. Its successful accomplishment in prior practices requires the use of expensive special jig and assembly equipment such as lead attaching pantographs which greatly reduce ap-' plied motion and thus permit relatively accurate positioning of the component parts, and prior practices require skilled labor when they are assembled by hand. Such hand assembly methods are slow and add materially to Of equal, or possibly of greater importance, is the matter of producing relatively minute semiconductor devices in the large commercial quantities required, and attaining uniformity in assembly and in operating characteristics for a particular design. Failure to solve this problem in this art has kept the manufacturing yield rate low, and kept the cost of the accepted units high.

Accordingly, it is a highly desirable objective to eliminate hand assembly and utilize mechanized or automatic assembly techniques in the manufacture of semiconductor devices such as transistors, but the accomplishment of the objective has left much to be desired in the past.

Another highly desirable objective in semiconductor device manufacture is the standardization of assembly procedure and equipment. At present, most commercial assembly procedures and equipment are relatively inflexible and can be used to manufacture only one or a few specific devices. Since the state of the art is advancing quite rapidly, they quickly become obsolete. Consequently, substantial savings in capital investment for new equipment could be made if the same or slightly modified equipment could be used in the manufacture of devices having different types of semiconductor die units and consequently different operating characteristics for equally different applications in electronic equipment. This is particularly important in this art, because relatively it is in its infancy and electronic equipment must be developed to utilize the semiconductor devices. With the development of equipment new devices are required. In all, it is a rapidly advancing art where there has been great obsolescence in methods, manufacturing apparatus, and devices as the art advances.

There could also be a substantial reduction in manufacturing costs if there could be some standardization of parts which could be used with many devices with different characteristics so as to require only one type of assembly equipment for all such different devices.

Another factor tending to increase the cost of semiconductor manufacture is the loss of expensive component parts when rejected transistors or other semiconductor devices are destroyed. In many transistor constructions, for instance, both the mounting header and the die unit must be discarded if the transistor fails to meet electrical specifications. In the great majority of cases, however, failure of a transistor to pass electrical specifications is due to some defect in the semiconductor die unit rather than to any defect in the mounting header. The mounting header is an expensive component of the transistor, but entirely satisfactory ones must be discarded if it is not possible to easily and quickly remove a faulty semiconductor die unit, when the transistor fails to meet the specifications in a stage of assembly prior to final canning. Such mounting headers would be suitable for reuse with other semiconductor die units, however, if they could be easily detached from the faulty die unit.

in the manufacture of alloy junction semiconductor devices, wherein the internal dimensions between alloyed junctions on the semiconductor die are critical, the penetration of the alloyed electrode into the die during alloying is material. This alloying penetration or depth depends upon alloying temperature, volume of alloying metal present, and contact area between the metal and the semiconductor die surface. When two electrodes, such for instance, as an emitter and a collector are alloyed to a die simultaneously and at the same temperature, it has proven difficult to control accurately the alloying depths of both electrodes and the internal dimension between the junctions. However, the art has considered that simultaneous alloying was necessary to economize time and handling and hence minimize production costs.

It is an object of this invention to provide a method of assembling semiconductor devices, which method is characterized by great flexibility and by rapid and simple adaptation to the manufacture of a variety of different devices, and particularly to the manufacture of low'and.

medium power transistors with alloy junctions, so that the same methods and assembly apparatus can'be used over a substantial period of time in this rapidly advancing art as changes are made in the operating characteristics or structure of thedevices. a V I It is also an object of the invention to provide an improvcd method of making alloy. junction transistors which permits very accurate control to be exercised over the depth of alloying of the electrodes into the semiconductor die and overcomes some of'the quality problems of prior methods.

A further object of this invention isto provide a manu- V facturing process and apparatus for diminutive alloy junction semiconductor devices which accomplishes mass production and low cost but a higher yield at the completion of the process than has been possible in the past.

Another object of the present invention is to provide .a'

transistor adapted to be manufactured economically, uniformly and at a high rate of production. 7

A further object ofthepresent invention is to provide also standardized to a degree such that-a substantially identical mechanical mounting will make possible numerous predetermined and'diiferentelectricaloper'ating chan' 7 settle into a final position on the angularly bent leads and on the' straight posts during heating for soldering, andbecause-of .the prior application of solder material at the connections to be made','soldering to the header acteristics in different transistors. i I V g It is another object of the present invention to provide an improved transistor structure fromwhichelectrically.

defective semiconductor die units 'can easily be'removed thus enabling the reuse of the mechanical mounting base equipment.

A still further featureof this invention is the provision of relatively inexpensive equipment including the jigs and loading apparatus described to obtain a high degree of accuracy of alignment in the{ assembly of all of the diminutive transistor parts, and the provision of a transistor structure which lends itself to handling by such Still another feature is the provision of'separate furnaces for the alloying of 'theemitter and the collector electrodes to the same semiconductor die. This permits the use of a difierent temperature in each furnace which enables the depth to which either electrode is alloyed to be controlled independently of the alloying depth of the other. By first alloying the more deeply penetrating electrode at a higher temperature, alloying of the more shallow penetrating one at a lower temperature can be carried out without influencing the penetrating of the first-alloyed'body. a

' Anotherifeature of the invention is the provision of a device subassembly made up' of a base connector strip and a' semiconductor die unit mounted thereon which becomesself-jigging when assembled on four posts or the postsand connector leads on a mounting header. The

i 1 base connector strip is provided with apair of arms having. engaging "means such as hooks formed in their ends for engaging upright posts of a mounting header and. enabling the subassembly to be quickly and easily 3 positioned on the header at the posts forsoldering there to, 'Angularly bent lead wires or posts in the header support and position small'wire leads from the electrodes on the semiconductor unit. Because the hooks hold'the subassembly against lateral movement, and the pieces canbe carried out quickly and eifectively on an economiportion with other die units and the consequent salvage of the cost of such baseportionsi A feature of this invention is the provision of aimethod of assembling alloy junction transistors which improves the accuracy with which electrodes maybe positioned'on a semiconductor die and suitable leads aflixed to the elec trodes so as'to provide a uniform product coming from an assembly line, and accomplish a'high yieldand lower costsof manufacture while speeding up therequired full production time relative to the yield accomplished. i

Another feature of the invention isthe provision'of cal mass .production'basis.

Still a further feature of the invention is the off-center mounting of the semiconductor die unit onthe aforementioned" base connector and consequent oif-center weight distribution of the'center' of such unit so-that lead i wiresextending from the die unit rest 'on and slide along the a method and apparatus 'foraflixing minute metal elec- I trode beads to an accurately predetermined portion of the '50 surface of a semiconductor die by placing the die between two halves of a jig having passages entirely therethrough 7% so that beads for forming the electrodescan be placed on the die in -the desired position simply by dropping them through the passages in the jig whose bores serveas guide means, heating the jig'and the; contained die and electrode a head to alloy the bead to .thedie at the desired position,.

subsequently inserting lead wires "through the passages guided by the'jboresthere'of to rest by their'own weight on the surfaces of the electrodes, and fusingfthe leads to,

the electrodes. This method and apparatus eliminates production yields.

-a manual alignment of the smallcomponent parts for 'the'devicethu's reducing-laborcosts, and also improves a filling apparatus for loading the minute electrode heads I into the'ji'g andj'anme'thod of operating, the-apparatus which includes first aligning .a plurality'of beadsin. regis try with'holes in the'surface of a vacuum chamber therein f so that the beads are'held in the desired position by the" vacuum within the ,chamben' and then moving the chamber so that the yacuu'r'n-heId beads; can be placed adjacent the ends of thepassages' in'the jig which has been moved below the chamber,jafter, which the beads aredropped therein by release of the vacuum.

aforesaid turned-over'or angularly bent ends of the header'mo'unting posts or leads as the subassembly settles into position on the header. QEach' post or; upright lead is on-center, in the header and the four provided in one embodiment are 'equilaterally vplaced therein, but the turned-over or' angularly bent portion of each'is offcenter and the subassembly lead wires rest on the same.

This construction 'anddimen'sioning assures that contact is maintained between the subassembly. lead wires and itsg connector strip; and the mounting posts during soldering 'of the subassemblyftofthe header, and'prevents the production of devices wherein the-parts areimperfectly connected by solder to the header.

In the accompanying drawings:

7 FIG; 1 is aggreatly" enlarged view in perspective of a transistor of'the present invention with its cover member broken away't oshow its internal structure; a

FIG; 2 is an exploded view of the transistor shown in FIG." 1 with the samefenlargement'to betterj illustrate the components making uprthe unit; I

FIG. 3 is an enlarged perspective broken view of one end of each half'of a heat resistant jig' or boat employed for guiding the pieces .to besecuredtogether by fusion or alloying into the semiconductor 'die unitin an assembly step of the presentfinvention,showing the two halves of 1 the jig in open position;

FIG.Q4 is'a fragmentary. view in section through a clos'edgjig of thetype showninFIG. 3, but enlarged over the showing in FIG. ,3, and illustrating the dropping of a minute metal bead toward onev face of asemiconductor die}? i i FIG. is a view similar to FIG. 4 showing the dropping of the other electrode bead toward a position on the opposite face of the semiconductor die;

- PEG. 6 is a view in' section similar to FIGS. 4 and 5 showing the positioning for affixing of a lead wire to one of the electrodes which is then alloyed onto a face of the semiconductor die; 7

FIG. 7 is a flow sheet illustrating the various steps of the assembly process and showing assembly equipment indiagrammatic form;

FIG. 8 is a perspective view of loading apparatus of the present invention for loading minute electrode beads onto semiconductor dice for alloying thereto, with the apparatus shown in somewhat diagrammatic form to better illustrate that portion which directly carries the beads;

FIG. 9 is a corresponding illustration in section taken on the line 9-9 of FIG. 8 and in the operating position of that figure with a number of electrode beads spaced over a surface of the apparatus;

FIG. 10 is a view similar to FIG. 9 showing the apparatus turned through an angle of 99, and with the electrode beads or pellets held in alignment with openings in the apparatus by differential air pressure;

FIG. 11 is a view similar to FIGS. 9 and 10' showing the loading device turned through an additional angle of 90 from FIG. 10 and in position for releasing and dropping the electrode beads into the jig of FIGS. 4- and 5;

FIG. 12 is a perspective view showing in greater structural detail the loading apparatus illustrated diagrammatically in FIGS. 8-11, and including the operating mechanism for the loader;

FIG. 13 is a View in section taken on the line 13ll3 of FIG. 12; and

FIG. 14 is a view similar to FIG. 13 showing the loading apparatus turned to the position shown in FIG. 11 for releasing and dropping electrode beads into a jig.

In practicing the present invention as directed particularly to a method for making alloy junction devices such as so-called transistors and such devices resulting therefrom, I provide a production line over which manufacturing steps are accomplished with a maximum of automatically operated equipment or apparatus and a minimum of hand labor to provide mass production of these diminiutive or relatively minute devices wherein a high degree of uniformity in structure and electrical operating characteristics are accomplished. This in turn provides a high yield in terms of acceptable units coming from the mass production operation.

The minute parts of a semiconductor subassembly are assembled in large multiples and primarily by automatically operated apparatus into heat resistant jigs which are then each moved into fusion furnaces for the heating and fusion together of semiconductor subassemblies. The collector and emitter electrodes and the wire leads extending therefrom are the most critical so far as the position thereof on the semiconductor die and so far as the fusion thereof together are concerned and accuracy of position and complete fusion are accomplished by loading and then fusion of first one electrode and then the other, and then loading and fusion of one wire lead on an electrode and thereafter the other wire lead on the other as a transistor, and the semiconductor subassembly are placed together and this is automatically movedinto a fifth fusion furnace for soldering together which accomplishes the assembly of all mechanical parts of the device except the final cover or can.

With the mechanical assembly complete, each device in this stage of completion is automatically electrolytically etched for cleaning, is washed to remove the solution, and electrically tested. Then a cover is placed on those assemblies which have not been rejected at the electrical testing stations for unacceptable characteristics or inoperativeness.

This invent-ion also includes an improved device-structure which emphasizes the effectiveness of the process and apparatus just described. The semiconductor subassembly for such device includes a flat enlarged metal strip which not only serves as part of the mechanical mounting means for the subassembly on a mounting headeras well as an electrical connector, but lends itself to the production of a plurality of subassemblies in an improved single heat-resistant jig. A plurality of such strips are placed in the jig and quickly aligned in a proper position so as to receive first a semiconductor die on each strip, and then metal electrode beads to be fused thereto, and lead wires to be fused to the electrodes so that electrical connections can be made to the semiconductor subassembly. The connector strip serves to mount a semiconductor die and additionally includes hooks on each end by which the final subassenrbly can be readily and simply positioned on corresponding posts of the mounting header.

The mounting header also represents an advance in the art of commercial importance in that four posts are equilaterally mounted therein and two of the four posts on the header are bent over at an angle to receive the wire leads from the subassembly while the connector strip "hooks are positioned on the straight posts to center that element, wherein the subassembly is held in position on the header prior to and during final soldering.The four posts are insulated in the header from a metal covering, and an insulating portion between the straight posts extends through such covering and between such two posts so that the strip will not be short circuited with the covering. In this respect, the configuration of the connector strip in combination with the header also facilitates the final assembly. The semiconductor die on the strip is offcenter. Although the four posts in the mounting header are secured therein in an equilateral position, the offcent-er arrangement of the semiconductor die on the connector strip insures that the thin wire leads extending in opposite directions from the electrodes thereon rest securely in the extended turned-over portion of each of two of the posts. Each such portion slopes toward the base portion of the post which is in the equilateral position described. As a result, the positioning of the semiconductor subassembly on the mounting header can be rapid because of the tolerances provided by the length of each turned-over portion. Solder material is at the joints and the subassembly settles down the sloping portion into a rigid predetermined position on the header when the solder is melted in the fifth fusion furnace.

Not only doe-s the complete mechanical structure of the device of this invention lend itself to quick and accurate assembly without jigs except the heat resistant block unit, but this same structure and the soldered connections of the subassembly to the header make it possible to heat and unsolder this subassembly from the header if the final electrical test before canning shows the subassembly to be unacceptable from an electrical and operating standpoint. Being able to salvage the header represents a substantial saving in cost of manufacture, and adds to other savings represented in the complete embodiment of the invention.

FIG. 1 of the accompanying drawings shows a perspective view of a completed transistor of the present invention with the cover portion broken away. FIG. 2 is an exploded view of the same transistor more clearly showing its component parts. The transistor generally indicated at it) includes a mounting header 11 which comprises a disc-like member 12 of glass or other suitable insulating material covered with a sheet of metal 11:! such as the arrange Q ductor die 27 and creates a PN rectifying junction within the die.

The electrical characteristics of an alloy junction type transistor are determined to a considerable extent by the depth of alloying the collector and emitter electrodes since this controls the distance between the PN junction in the semiconductor die. This alloying depth is determined by the volume of alloying material available, the area Wet by the alloying material and the alloying temperature. The collector furnace 1% is an electric resistance furnace containing an atmosphere that is inert with respect to the material making up the transistor. In general, such atmospheres are reducing or non-oxidizing. Nitrogen, argon, or a mixture of nitrogen and hydrogen are suitable atmospheres. The temperature maintained within furnace 105 is dependent upon the electrical characteristics to be produced in the transistor since these are, to at least some extent, controlled by the depth of alloying of the indium. In accordance with the present invention, temperatures between about 490 and 700 C. are employed, with high temperatures being used when greater alloying depth is required. In one embodiment of the invention, a temperature of about 580 C. is employed in the collector furnace. In one embodiment of the invention, the total residence time of each jig in the furnace is about minutes with a jig leaving the furnace every seconds. This provides suificient time to obtain equilibrium alloying at the temperature specified. There is no practical upper limit on the heating period since once the alloying of the indium and germanium is accomplished at a particular temperature, it will not proceed further unless the temperature is raised.

The jig 33 is moved from the cooling chamber of furnace 165 to the jig-turning station 107 where it is inverted either manually or by suitable mechanical means so that the block 35 of the jig is now facing up. The turned jig then passes to the emitter insert station 198 and the emitter electrode head 29 is dropped through the passage 39 (FIG. 5) so that it rests on the surface of the semiconductor die 27 directly opposite the collector electrode 30. In making transistors in which the emitter electrode is somewhat smaller than the collector electrode, the passage 39 is of somewhat smaller diameter than the passage 40 through which the collector bead 3% was dropped. The passage 39 is also flared at its mouth to make inser- 1 'tion of the electrode bead easier and is narrower near its bottom so that it will serve to properly position the indium bead on the surface of the semiconductor die. As in the case of the insertion of the collector head, the emitter head is inserted by the mechanical insertion means of FIG. 8 to be described subsequently. A predetermined amount of the ammonium chloride-alcohol fiuxing solution is introduced through passage 39 onto bead 29.

The loaded jig 33 then passes to emitter furnace 169 which is identical with collector furnace 195 and employs the same atmosphere, but it is maintained at a somewhat lower temperature to provide for less alloying penetration of the emitter than the collector. For example, in the embodiment of the invention employing a temperature of 530 C. in the collector furnace, a temperature of about 520 C. is employed in the emitter furnace. Once the alloying of the collector bead has been completed to equilibrium in furnace 105, subsequent exposure of the collector to a lower temperature will in no Way affect its alloying depth. If both the collector and emitter electrodes were fused to the semiconductor die in the same furnace at the same temperature, that temperature would determine the depth of alloying whereas, in accordance with the present invention, where alloying is carried out in two separate furnaces, at two different temperatures, well controlled depth of alloying can :be obtained for the emitter by first fusing the collector electrode to the die at a somewhat higher temperature. In many applications of the invention, such as in the manufacture of diffused base transistors, very shallow alloying is desired for the emitter while deeper penetration is desired for the collector. This is accomplished by first alloying the collector to the desired depth and then alloying the emitter to a lesser depth at a lower temperature so that it does not affect the depth of alloying at the collector electrode. Once the collector has alloyed to its equilibrium depth at a particular temperature the alloy region will not penetrate further unless that temperature is exceeded.

Independent control of alloying depth of the electrodes in the present method and apparatus also permits accurate control of the distance separating the two PN junctions in the semiconductor die or so-called base width of the PNP transistor. This dimension has an important effect on the electrical characteristics of the unit. Because of the independent control of each alloying step the process can be used to manufacture units of diiferent electrical characteristics by varying the alloying temperature. Although the atmosphere and residence time employed in the two electrode alloying furnaces are normally the same, they could be varied if required.

Although the foregoing description has referred specifically to a particular type of alloying and particular materials, it Will be understood that the process or" the invention can be easily modified to form other types of alloy junctions. For example, the operating conditions of the alloying furnaces could be modified to heat a semiconductor die upon which a metal had been deposited, as by evaporation, and form a so-called toasted alloy junction. In such a modified process, the same base connectors, jigs and the like could be used as are employed in the emb0diment described in detail. Further, it will be understood that semiconductor dice employed may be of either conductivity type, may contain regions of varying resistivity as in the case of graded base transistors, or may have Whatever electrical characteristics are required to produce a predetermined device.

After the alloying of the emitter electrode 29 has been completed, the jig is turned over at the inverting station llll and passes to the collector lead insert station 112. Alternatively, and so far as the face which is up is concerned, the jig can remain in the same position it is in when it comes out of the furnace 1&9, and in that position a wire is inserted in the jig at the lead insert station 112, as will be described. At collector lead insert station 112, a collector lead wire 32 is inserted through each passage 40 either by a wire loading mechanism which cuts the leads to length and lock them automatically or by hand, and allowed to rest with its end held against collector electrode 30 by gravity (FIG. 6). The collector lead wire 32 is made of gold-plated silver because of the ease with which indium and gold wet one another so that they can be electrically connected merely by making contact and heating. Unplated silver wire also may be employed but higher temperatures are required. Positioning of the lead wire 32 is accurate because it is guided by the bore of the passage 40 and automatically positioned thereby on the surface of the collector electrode 3t). As shown in FIG. 6, lead wire 32 is of such a length that it does not extend beyond the outer surface of the jig. This permits insertion of the jig without disturbing the position of the lead.

The jig with the lead wire 32 inserted therein is then passed by a pneumatic pusher to collector lead furnace 113 which is also an electric resistance furnace containing a neutral or nonoxidizing atmosphere and maintained at a temperature between about 300 and 400 C. In one embodiment of the invention, a temperature of 380 C. is employed. At this temperature the lead 32 readily fuses to the indium electrode 36 and is mechanically afiixed and electrically connected thereto. The lead wires are about one-half the diameter of the electrode to which they are fused. It has been observed that they are well centered is described. method and apparatus of the invention may be usedto attach lead-wires to other types of contacts either rectify-n.

with respect to the electrodes and this is believed to be due to the surface tension of the indium as it becomes molten during the fusion process. The residence time in the collector lead furnace is substantially the same as that i of the two electrode furnaces.-

After the attaching of the collector lead the jig passes inverting station 115 from which it passes to the emitter lead insert station 116. At this point the emitter lead .31

is inserted into the passage 39 in exactly the same way as y the collector lead 32 was inserted into' the passage 40', and the jig passes to the emitter lead furnace 117 where the silver emitter lead wire is fused to the indium by heating under the same conditions asobtained in the collector lead furnace 113. The jig and its contents are then cooled, and the completed subassemblies 17 are removed at sta tion 118 by opening the jig and separating the blocks;

In some instances it has been found desirabl to provide means for vibratingthe jigs after the leads have been in-: serted and before they are fused to their corresponding;

electrodes. Such vibration prevents the leads from be coming stuck in the jig openings in positions where they form an angle of about 30? with. the upper surfaces of y 26 (FIG. 2) are dropped over posts. '15 and 14 respectively onto the hooks engaging these posts, and solder rings 31a and 32a are dropped over the turned-over sloping ends of posts 13 and 14 to rest against leads 31 fail to contact the electrodes, and it generally providesfor more effective lead attachment. This may be accomplished by mounting the lead attachingfurnaces 113 and 117 so they can be vibrated,'and it is indicated in FIG. 7

by referenceinasmuch as the details are not a part of the present invention.

In the embodiment of the invention particularly illustrated, the attachment of lead wires to alloyed electrodes It will .be' understood, however, that the and32 respectively. The resultingunits pass along track 119. (FIG.- 7) to furnace 122 wherein the'solder rings i melt to form joints connecting the subassemblies .to their headers mechanically and electrically.

. As the subassemblies are placed on the headers, they are roughly oriented with the base connector arms substantially parallel to thevupper surface ofthe header. As the solder rings melt, the subassembly 18 will tend to vsettle'into the stable position shown in FIG. 1 as the lead wires 31 and 32- slide along the bent-over end portions of posts 13 and 14 respectively. Because the semiconductor die 27 is carriedon connector 18 in a position somewhat oif-set from its center toward the same direction in which the turned-over ends of posts 13 and 14 are bent, the

. lead wires extending from the die will make contact with ing or ohmic with the same resulting advantages of ease and accuracy of positioning, reproducibility, high productionyield and economy. For example, a semiconductor die having plated electrodes can be positioned within the jig 33 with a base connector and solder ring and thejig introducedinto'the process at the wire loader 11 2. Lead attachment is thenaccomplished in the manner previously described makingsuch changes in furnace temperatures and the like as are. expedientfor the particular materialsemployed. 7 Similarly, semiconductorbodies-having dif-J fused or grown rectifying junctions andohrnio contacts on their surfaces may have lead wires accurately attached to such contacts in accordance wtih the present invention.

-Such flexibility is one of the advantages of the invention since it enables a wide variety of transistors to vbe manufactured using the same equipment andgene ral assembly procedures and thustends tokeep' such'equip'ment from becoming obsoleteas transistor structures anclcharacteristics are improved. 1

The completed subassemblies are of aconfiguration whichfacilitates their quick 'and'accurate alignment'on 'the posts even if the subassembly is slightly misaligned, ,andthe chance of making a faulty connection to the I lead wires is minimized.- 7 As the solder melts,.the angu-' lar disposition of the. post ends insures contact by the leads to be maintained as the subassembly '18 settles into itsmost stable position.

As the subassembly. liisettles during" soldering, the

edge of the enlarged portion 19a engages the exposed surface of insulating body 12' and is maintained in the 7 stable position. shown in FIG. 1. The provision of the ,por'ting the base connector 18 permits self-jigging of exposed'insulating area on the header surface for supthe subassembly 17 on 'a header'which is 'otherwise of standard designfthis construction can be used to mount wide variety of semiconductor subassem'blies.

' The shape'bf the exposed insulating area between ,p'osts 15 and" 16 prevents shortcircuiting ofthe base connector-to the metal covering of theiheader since 'the connector will not contact the covering 1151 even if it should be mounted in a tilted position aswith one 'of its arms'resting on the header; ,Theprovision ofthe metal cover 11a over other portions or the header body 12 improves electrostatic shielding of the unit.

a slightly modified standard mounting header having-four .equilaterally spaced mounting posts. As indicated in FIG; I

.7, headers 11 are loaded in an upright position onto a j moving conveyor-belt or track 119' at. station 120 and pass to the loading station 121. .At this position, an operator or a suitable loadingjmechanism drops a subassembly onto a header with the hooks 24 and 25 of the shorter arm 21 engaging .the dummy or electrically inactive post 16. and with the hook 22' of thelonger armj2tl engaging the base-mounting post 1 5. (seejFlG. l Shorter arm 21 is provided with a pair of hooks to enable an op erator to distinguish one end ofjt-he base connector from the other and so orientsuccessive 'su-bassembliesuniforrnly with respect to the headers on which they are mounted. Whenthe subassemblies vare'placed 'on the headers .rnanually, the operator usually engages post'16 first and then slips hook 22'around post 15.

As thesubassembly is placed on the header, the 'emit ter and collector leads 31and 32 contact the turned-over bent toward the shorter arm 21 of base connector 18 and It will thus beseen that the configuration of the base connector 18; and the provision of the bent-over end I portions 'of' posts 13 and 14. enables the .subassembly '17 to be self-jigging w-ith respect to'header 11 so that solderconnections can be made easily and accurately at a high rate of produ'ction with a high yield of electrically satisfactory units. Because the subassembly is selfjigging, soldering can be accomplished, by placing solder rings or'placing solder in some; other manner on {the assembly jointsrto be soldered and passing it through V a furnace. This results in cleaner, better aligned and more'uniform units than couldbe produced by manual "soldering since, manual soldering .may' cause smearing and dirtying and misalignment infhandlingto' an extent and sloping end portions of-emitter and collector mount: I ing posts 13 and 14'resp'ectively; The end portionsare H that might result in anunacceptable unit." 7

In. addition 'to, improving product yield 'and repro du cibility, the invention accomplishes these 'improvements inconjunction with a substantial reduction of operators needed to maintain .a given rate'of production. Thus, a reduction of 25% m'50% in the number of operators requiredfor ,ajgiven rate of production can be obtained by lusi'ngtthef presentinvention instead of conventionallmanual assembly techniques.

7 die about 0.060 inch square.

. form an electrode in such embodiment is 0.010 inch in Following the soldering operations, the units are removed from the belt 119 and placed in individual carriers which hold the lower portions of posts or leads 13, 14 and 15 in a fixed position and establishes a reference surface for loading in sockets of :an automatic etching facility shown at 123 in FIG. 7. The units are plugged into sockets on a moving belt and carried successively through an electrolytic etching bath, a deionized water rinse, a pressurized air-water mist rinse, a high pressure air blow-off, a radiant heat drying position and an unloading position. The units then pass to electrical testing stations which may be provided with automatic sorting and ejection means. Although it is expedient to carry out the etching, washing and testing steps by the mechanized means described, the invention may also be practiced with these steps accomplished by other means whether mechanized or not, and the specific mechanism used in the commercial embodiment of the present invention is not a part of this invention.

Assembly of the transistor is completed by the attachment of cover member 46. The cover is made of mild steel or nickel silver and which rests on the lip or shoulder 11b of header 11. The cover member 46 is aflixed to the header by welding to such shoulder.

In accordance with one embodiment of the invention, the covered unit is vacuum baked and a suitable heat transfer liquid such as silicone oil is introduced through a pin hole in the cover member to fill the space between it and the transistor components. After filling, the pin hole is sealed. Alternately, the cover member 46 may be turned upside down and filled with a predetermined amount of heat transfer liquid and the partially assembled transistor lowered into it and then the cover member suitably aflixed. However, certain embodiments of the invention are used in applications where the amount of heat to be dissipated during operation is not great enough to require the presence of a heat transfer liquid in the unit.

Subsequent to etching and washing and before attachment of the cover member 46, the transistor in its partially assembled condition is tested for its electrical and other characteristics. If a particular unit is found defective, the subassembly 17 can subsequently be separated from the header 11 simply by heating to melt the solder and lifting the subassernbly off the posts. The header, which forms the most expensive single part of the transistor, can then be reused with another semiconductor die unit and need not be discarded. In other transistor constructions where the electrically operative parts of the transistor are of a construction and assembly less easily put together, and where the parts are Welded to the header, it is difficult to make this separation without damaging the header. In such instances, the header cannot be reused and must be scrapped thus adding materially to the overall cost of the entire manufacturing operation.

With the transistor referred to as one embodiment of the present invention, the diminutive size can be more readily understood. For instance, in accordance with a typical embodiment, the header 11 is about 0.345 inch in diameter at shoulder 11b and includes mounting leads of 0.004 to 0.007 inch in diameter. The base connector 18 is about 0.200 inch long and supports a semiconductor Emitter bead 29 used to diameter while collector bead 30 is 0.014 inch in diameter. FIG. 1 of the drawings is on a scale about four times as large as a typical commercial unit. Of course, other sizes of electrodes, leads, etc. can be used by simple modifications in the assembly equipment such as changing the size of the openings in the jig 33. It can readily be appreciated that the accurate and uniform alignment of such minute parts would be difficult if not impossible to achieve manually. However, it is accomplished at a high rate of production by the present invention.

The insertion of the collector and emitter beads at stations 104 and 108, by electro-pneumatic operated automatic loading means illustrated somewhat diagrammatically in FIGS. 8-11 and in greater structural detail in FIGS. 12-14 also illustrates the effectiveness of the present invention to handle minute parts. In a typical embodiment of the invention, emitter bead 29 is 0.010 inch in diameter, while the collector head 30 is 0.014 inch in diameter. It is difficult and time consuming to pick up such small objects one at a time with tweezers or the like and insert them manually through the holes in the jig. The loading device indicated generally at 50 in FIG. 8 overcomes this problem. It includes a flat surface 51 having a series of openings 52 formed therein of smaller diameter than the electrode beads. Each opening 52 communicates with a vacuum chamber 53 within the unit, and one wall of the chamber 53 has the flat surface 51 on the outside thereof. A curved cradle portion 54 forms a continuation of the chamber wall and is adjacent the flat surface 51 on that wall. A number of electrode beads 29 are spread over the surface 51 and a partial vacuum is produced in the chamber 53 by exhausting air through conduit 55. The production of this partial vacuum is made possible by the fact that openings 52 are blocked by aligned beads 29. The device is then turned from its upright or first position shown in FIGS. 8 and 9 to the second position shown in FIG. 10. Because of the vacuum in chamber 53, the beads 29 which are aligned with the openings 52 are held against them by diflferential air pressure of the ambient atmosphere while the other beads fall into the cradle 54 as shown.

The loading device is then turned through another to the third position shown in FIG. 11, and each retained bead 29 is positioned over a corresponding passage in the jig 33 which contains the base connector, the solder ring, and the semiconductor die. The spacing between adjacent openings 52 corresponds to the spacing between adjacent passages in jig 33 so that proper positioning is possible. The vacuum is then turned off and positive air pressure introduced into the chamber 53 through the conduit 55. This disengages the beads 29 from the openings 52 and causes them to fall through the corresponding passages in the die and onto the surface of the semiconductor wafer directly below.

Use of the loading device 50 is substantially faster than manual loading and also results in loss of fewer electrode eads. By providing holes 52 of somewhat smaller size than the emitter electrode, the same device may be used for loading both the emitter and the larger collector beads.

FIGS. 12-14 illustrate in greater detail the mounting of ones of the bead loaders, and show how it is moved to its various positions. The loader 50 includes a transverse shaft 60 rotatably mounted in brackets 61 and 62 and carrying a pinion gear 63 adjacent one end. Jig 33 is brought into position for loading by suitable conveyor means indicated at 103. Flexible conduit 55 is connected to the chamber portion 53 to partially evacuate the same while the device is in its first position (FIGS. 12 and 13) so that beads can be held against the openings 52. Reciprocating rack 64 engages the pinion 63 and is actuated by air cylinder 65 which is in turn controlled by air supply conduit 66.

To load beads into jig 33, air cylinder 65 is moved for- Ward to the position shown in FIG. 14 causing rack 65 to rotate pinion 63 turning loader 50 to its third position (FIG. 11). In this position, beads held to the openings 52 are aligned over openings in jig 33 and fall into the jig when positive air pressure is supplied to chamber 53 through conduit 55.

In order to insure rapid action of the beads in moving into positions aligned with the holes 52 of the loader and in dropping into the jig an electric vibrator V is provided in the mounting (FIG. 12) for the bead loader. This can be adjusted so that the vibration is very slight, but available if required.

. The improved assembly method of the present invention, therefore, permits quick and accurate positioning of the various minute parts of a semiconductor device to be accomplished economically and consistently. In making an alloy junction transistor in accordance with the present invention, a high degree of control can beeXer cised overthe extent of electrode alloying into the semiconductor die by providing independenttemperature control of the alloying of each electrode. Furthermore, the process is highly flexible in that it can be adapted to the manufacture of a wide variety of semiconductor devices" of different electrical characteristics, thus providing for different customer requirements asthey arise in the application of such devices'to circuits-and electronic equipment.

To assist in accomplishing results of the present assem& bly method, the invention provides a jig for'holding' the parts of the semiconductor die assembly and a'bead'or pellet loaderto quickly and reliably feed the minute metal electrode elements to the jig. Unless-the semiconductor die subassembly for the final'unit is complete, and with its parts aligned and mechanically and electrically joined, 7

the final device is defective. The reliability of the process and apparatus of the presentinvention is an important factor in the commercial value of the whole The equipment and techniques of the invention are easily modified to accommodate them to advances in the semiconductor art as represented in new developments in the sernicon'-- ductor die and the .subassembly including the sameso that such equipment does not become obsolete prematureiy." I

As to the transistor structure of the present invention which is electrically and mechanically stable, it is particularly suited to assembly by the rapid, easy and automatic techniques of the method and apparatus herein disclosed. Because'ofthe novel structure of'the transistor and its component parts, the lattertare' automatically and proper- ,ly. aligned with one another, during assembly tog'reatly increase the efficiency, to reduce the number of operators employed in contrast to a hand assembly, the cost of manufacturinggjthe devices.

and to reduce; q I The transistor structure is particularly. adapted for low andlmedium power applications, andcanbensediin' conjunction with j 'a wide variety of semiconductor bod-ies and differenttypes of alloyed junctions. Moreover, because'of theconfigura tion of the semiconductor subassembly, it cansbe easily and accurately affixedtosupport posts of a standardized mounting header by'soldering'and can easily be removed from the header'without injury to the latter if the subassembly isfoundelectricallydefective; The mounting header can then be reused with'another' s'ubassembly. This also effects material manufacturing economies;

- In all, therefore, the invention herein disclosed reprei sents an important improvement in the semiconductor art I .in that it provides technical advances'inmethods and Tstructures, and provides a commercialadvance in a lower 1- 16- 7 cost stable device with verywide areas for application to equipment.

Iclaim; V

The method of manufacturing alloy junction semi- ,conductorde vices where a jig is employed and continuouslyelosedduring the manufacturing operation employing the jig, with the jig' having a shaped cavity on the inside thereof anda hole in reach of two opposite sides thereofi extending from the outside of the jig into the.

cavity, said .method comprising the steps 'of placing in the shaped cavity a semiconductor element having two sides and ametal conductor member to be fused together by heat during the manufacturing operation, with said element and said member remaining in the same relative position in the jig, dropping a metallic bead into one of saidholes of the jig so that it falls guided by the bore of'said hole onto one side of the semiconductor element, heating said element and the other contents of said jig to fuse said bead to said element, inverting the serrnconduc-- tor element while leaving the same in the closed jigso that said element faces upward, dropping another metallic bead into the second hole ,to fall guided, by the-bore thereof onto theother face ofsaid element, heating said element and the: othersco nte'n ts of said jig rtofuse the other head to said 'element, inserting a lead wire into one ofthe two holes to fall onto a corresponding bead, heating the bead to fusesaid, lead wire to the bead, inverting the 'contents of the jig so: that the semiconductor element faces upward at its opposite: face, inserting a lead wire into the hole corresponding to the other bead until it engages the bead, heating the other bead to fuse the latlter mentioned lead wire to said other bead.

' lReferencesnCited bythe Examiner I r 2,971,869 2/61.. Taylor. 1 f

RICHARDVH. EANES, J g-Pr ar Examiner. V v V 

